Glass Hole Drilling can be reviewed for Glass Substrate, but the accepted route depends on glass grade, supplied form, dimensions, feature geometry, wall section, edge distance, finish and inspection method. The assigned process record notes: Glass Drilling: source-backed external reference facts retained from V3.2.1; only numeric facts are counted as numeric capability data. The assigned product record adds: Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon.
How Glass Hole Drilling Applies to Glass Substrate
Glass Hole Drilling can be reviewed for Glass Substrate, but the accepted route depends on glass grade, supplied form, dimensions, feature geometry, wall section, edge distance, finish and inspection method. The assigned process record notes: Glass Drilling: source-backed external reference facts retained from V3.2.1; only numeric facts are counted as numeric capability data. The assigned product record adds: Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon.
Glass Substrate
Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon
Glass Hole Drilling
Glass Drilling: source-backed external reference facts retained from V3.2.1; only numeric facts are counted as numeric capability data.
Feature-specific approval
Tool access, wall section, edge distance, finish, datums, tolerance and inspection method must be approved for the actual drawing.
Compatibility Between the Product Geometry and Process Route
The review separates the intended operation from product-family assumptions and drawing-specific constraints.
| Review area | Assigned technical basis |
|---|---|
| Process purpose | Glass Drilling: source-backed external reference facts retained from V3.2.1; only numeric facts are counted as numeric capability data. |
| Product geometry | Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon |
| Typical input form | Flat sheet, blank, tube, rod or preform as applicable to the named process |
| Process limitations | Public supplier values are not universal; blank numeric fields indicate that no transferable public value was verified |
| Inspection basis | Dimensional and visual inspection; add microscopy, profilometry or interferometry when the drawing requires it |
Glass Substrate Features That Affect the Process
Product-form records describe typical geometry and inspection needs; the supplied glass grade and drawing remain controlling inputs.
| Product requirement | What to define |
|---|---|
| Geometry and available forms | Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon |
| Dimensions and thickness | 4–12 inch semiconductor quartzware context; wafer diameter and SEMI edge/notch requirements must be specified |
| Holes, cutouts and features | Dimension holes, slots, cutouts, steps, grooves, radii and their edge distances. |
| Edge and surface zones | Ground edge, chamfer or SEMI-style profile selected to reduce handling fracture |
| Inspection | Thickness map, TTV/bow/warp metrology, interferometry, edge-profile inspection, particle and surface-defect inspection |
| Packaging and handling | State cleanliness, protective film, separators, individual packing and shipping requirements. |
Glass Hole Drilling References and Design Limits
Numeric values appear only when verified public process evidence is assigned. Proxy-family pages intentionally suppress numeric ranges.
| Process parameter | Reference value | Applicable condition |
|---|---|---|
| Minimum Thickness | 0.76 mm | CNC drilling program |
| Maximum Thickness | >25.4 mm | CNC drilling program |
| Minimum Part Size | 50.8 x 50.8 mm | CNC program; smaller parts need dedicated holding |
| Maximum Part Size | 2286 x 1524 mm | CNC program envelope |
| Minimum Hole Diameter | 0.5 mm | SCHOTT special drilling process range 0.5-40 mm |
| Maximum Hole Diameter | 300 mm | SCHOTT standard flat-glass hole range 3.5-300 mm |
| Minimum Edge Distance | greater of 2 x glass thickness or 1.5 x hole diameter, capped at 50 mm for holes up to 60 mm | SCHOTT processed-flat-glass design table |
| Dimensional Tolerance | ±0.508 mm general; up to ±0.127 mm | JNS/Abrisa CNC drilling program |
| Design item | What must be reviewed |
|---|---|
| Thickness and part envelope | 0.76 mm >25.4 mm 50.8 x 50.8 mm 2286 x 1524 mm |
| Feature size | 0.5 mm |
| Edge distance and wall section | greater of 2 x glass thickness or 1.5 x hole diameter, capped at 50 mm for holes up to 60 mm |
| Tooling and process condition | Cat-i states that its glass drilling techniques include diamond tooling and high-pressure abrasive methods.; Vitrum states that its CNC fabrication machine drills, mills, polishes and cuts holes and notches. |
| Tolerance and finish | ±0.508 mm general; up to ±0.127 mm |
| Drawing review | For Glass Hole Drilling on Glass Substrate, identify the glass grade, datums, processed features, edge and surface zones, quantity and inspection method. |
Inspection Focus for Glass Substrate Hole Drilling
Inspect the processed feature together with adjacent edges, surfaces, wall sections and functional zones.
| Review item | Project-specific focus |
|---|---|
| Process defects | Chipping, cracking, subsurface damage, dimensional error, contamination or surface defects as applicable |
| Process limitation | Public supplier values are not universal; blank numeric fields indicate that no transferable public value was verified |
| Design condition | Define material grade, thickness, geometry, edge distances, datum scheme, surface/edge acceptance and inspection method |
| Product design risk | Edge chips, high TTV, bow/warp, particles, alkali contamination and mismatch with bonding temperature |
| Product inspection | Thickness map, TTV/bow/warp metrology, interferometry, edge-profile inspection, particle and surface-defect inspection |
| Acceptance method | Flatness Measurement: Compare calibrated result with the drawing, purchase order or approved test specification |
Information Needed Before Quotation
Provide the glass grade, supplied form, dimensions, feature location, edge and surface requirements, quantity and inspection method.
RFQ inputs
- Diameter, thickness, TTV, bow, warp, edge profile, notch or flat, material grade, surface finish, particle limit, cleanliness and packaging
- Define material grade, thickness, geometry, edge distances, datum scheme, surface/edge acceptance and inspection method
- Provide a drawing revision, material or grade, quantity, dimensions, tolerances, critical surfaces and the required inspection record.
Selected Product and Process References
References support the assigned records but do not replace a drawing-specific feasibility review or approved first article.
- Cat-i Glass Drilling Beveling and SawingCat-i Glass
- Precision Drilling and MillingVitrum Glass Group
- Abrisa Glass Machining CapabilitiesAbrisa Technologies
- JNS CNC Glass Machining, Drilling, Slotting and GroovingJNS Glass
- Processed Flat Glass technical detailsSCHOTT
Request a Project-Specific Glass Review
Send the drawing, material, dimensions, quantity, tolerances, surfaces and inspection requirements for feasibility review.
- Process: Glass Hole Drilling
- Drawing or part sketch
- glass type/grade
- Thickness / part size
- Quantity
STEP/STP, DXF, DWG, PDF, IGS/IGES or ZIP.
Confidential drawing review. NDA support available on request.
Frequently Asked Questions
These answers use the material, process, product and application data assigned to this page.
Can Glass Hole Drilling be used for Glass Substrate in Glass Substrate Hole Drilling?
Glass Hole Drilling can be reviewed for Glass Substrate, but the accepted route depends on glass grade, supplied form, dimensions, feature geometry, wall section, edge distance, finish and inspection method. The assigned process record notes: Glass Drilling: source-backed external reference facts retained from V3.2.1; only numeric facts are counted as numeric capability data. The assigned product record adds: Round wafer, flat/notched wafer, carrier wafer, structured wafer or bonded panel coupon.
Which product features affect Glass Hole Drilling for Glass Substrate Hole Drilling?
For Glass Substrate Hole Drilling, thickness, feature size, edge distance, wall section, internal radii, tool access, datums and protected surfaces can change the accepted process route.
Are the process values on Glass Substrate Hole Drilling guaranteed finished-part limits?
No. For Glass Substrate Hole Drilling, published process references retain their material and geometry conditions; the quotation and approved drawing define the finished-part acceptance limits.
Which defects should be checked after Glass Hole Drilling on Glass Substrate?
For Glass Substrate Hole Drilling, inspect feature position and size together with chips, cracks, breakout, edge condition, scratches, contamination and adjacent-wall damage.
How should Glass Substrate Hole Drilling be inspected?
For Glass Substrate Hole Drilling, connect each critical drawing characteristic to an agreed instrument, datum, fixture condition, sampling plan and numeric acceptance limit.
What should an RFQ include for Glass Substrate Hole Drilling?
For Glass Substrate Hole Drilling, diameter, thickness, TTV, bow, warp, edge profile, notch or flat, material grade, surface finish, particle limit, cleanliness and packaging.