ANTGLASS manufactures custom glass wafers for MEMS, microfluidics, sensors, bonding, optics, semiconductor processing and advanced packaging.
A wafer must be specified as a geometry and surface system—not only by diameter and thickness. TTV, bow, warp, edge profile, notch or flat, surface finish, cleanliness and packaging all affect downstream handling and yield.
Product Types and Selection
| Wafer parameter | What it controls | Why it matters |
|---|---|---|
| TTV | Maximum thickness variation across the wafer | Bonding, lithography and process uniformity |
| Bow | Median-surface displacement in a free state | Handling, chucking and bonding |
| Warp | Total deviation across the wafer | Process alignment and equipment compatibility |
| Edge profile | Edge shape, flat or notch | Strength, orientation and automated handling |
Material Options
Common wafer materials include EAGLE XG glass for stable electronic and sensor substrates, fused silica for low expansion and high purity, and BOROFLOAT 33 for borosilicate wafer applications.
Specifications to Put on the Drawing
- Material, diameter and thickness
- TTV, bow, warp and measurement method
- Edge profile, flat or notch
- Single-side or double-side polish
- Surface quality and roughness
- Cleaning, cassette, tray and packaging
ANTGLASS Manufacturing Capabilities
ANTGLASS manufactures wafer blanks, controls diameter and edge geometry, grinds and laps thickness, provides single-side or double-side polishing, adds flats, notches and holes, and supplies ultrasonically cleaned wafers in protected packaging.
Inspection, Cleaning and Packaging
Wafer release includes diameter, thickness, TTV, bow, warp, edge profile, surface condition, cleanliness and orientation. The measurement method is recorded because geometry values depend on how the wafer is supported and measured.
Typical Applications
Glass wafers are supplied for MEMS, microfluidics, anodic bonding, wafer-level packaging, sensors, optics, photonics, coating, lithography and research.
Glass Wafer Geometry and Process Planning
Wafer geometry values are meaningful only when the measurement method and support condition are known. TTV controls thickness uniformity; bow and warp describe different forms of out-of-plane shape. A wafer may meet a thickness requirement but still create problems in vacuum chucking, bonding or lithography if bow or warp is excessive.
The edge profile protects the wafer during handling and equipment loading. Flats and notches provide orientation, while a polished edge can reduce particle generation and chipping risk. The selected profile must match the customer’s cassette, aligner, bonding tool and downstream process.
- State the wafer diameter and measurement standard.
- Define TTV, bow and warp separately.
- Identify polished sides and allowed edge exclusion.
- Specify notch, flat, holes and alignment geometry.
- State particle, stain, contact-mark and packaging limits.
For temporary handling and thinning processes, pair the device wafer with a dedicated glass carrier wafer. For non-round formats, use a custom precision glass substrate.
Frequently Asked Questions
What materials are used for glass wafers?
ANTGLASS manufactures wafers from borosilicate glass, fused silica, fused quartz, alkali-free display glass and other optical or technical grades selected for bonding, thermal expansion, optical transmission and process compatibility.
What do TTV, bow and warp mean for a glass wafer?
TTV is the difference between the maximum and minimum wafer thickness. Bow describes the displacement of the wafer median surface in a free state, while warp describes the total deviation across the wafer. The measurement method should be stated.
Can ANTGLASS supply double-side polished glass wafers?
Yes. ANTGLASS supplies ground, lapped, single-side polished and double-side polished glass wafers with controlled thickness, edge profile, flat or notch geometry and cleaned packaging.
Can glass wafers include holes, flats or notches?
Yes. Wafers can include orientation flats, notches, alignment holes, custom through holes, diced outlines and other drawing-defined features.
How are glass wafers cleaned and packaged?
ANTGLASS provides ultrasonic cleaning, controlled rinsing and drying, low-contact handling, functional-side identification and separated wafer packaging using suitable trays, separators or cassettes.