ANTGLASS manufactures precision glass substrates for coatings, sensors, electronics, displays, bonding, microfluidics and optical assemblies.
The substrate is the foundation of the downstream process. Material, surface finish, flatness, thickness, cleanliness and thermal behavior determine how well coatings, patterns, adhesives, deposited films and bonded devices perform.
Product Types and Selection
| Substrate route | Surface condition | Typical use |
|---|---|---|
| As-cut or ground substrate | Economical dimensional base | Fixtures, covers, non-optical bonding |
| Lapped substrate | Improved flatness and thickness control | Bonding, mechanical reference, process development |
| Single-side polished substrate | One functional optical or coating surface | Sensors, coatings, displays |
| Double-side polished substrate | Two functional surfaces and controlled geometry | Optics, microfluidics, wafer processes |
Material Options
ANTGLASS processes EAGLE XG for thin-film and electronic substrates, fused silica for UV, purity and low-expansion applications, and BOROFLOAT 33 for thermally stable industrial and laboratory substrates.
Specifications to Put on the Drawing
- Material and downstream process
- Length, width, diameter and thickness
- Flatness and parallelism
- Surface finish or roughness
- Holes, slots, notches and alignment features
- Functional side, cleaning and packaging
ANTGLASS Manufacturing Capabilities
ANTGLASS provides cutting, CNC profiling, drilling, slotting, grinding, lapping, single-side polishing, double-side polishing and ultrasonic cleaning. Substrates are supplied as plates, discs, wafers and custom-shaped components.
Inspection, Cleaning and Packaging
Inspection controls dimensions, thickness, flatness, parallelism, feature position, edge profile and surface condition. Functional sides are identified and protected for coating, bonding or assembly.
Typical Applications
Glass substrates support optical coatings, sensors, displays, microfluidics, electronics, diagnostic devices, thin films, bonding and laboratory research.
Glass Substrate Selection by Downstream Process
Coating, bonding, printing, lithography and microfluidic processes place different demands on the same substrate. A coating process may prioritize surface roughness and cleanliness, while bonding may require flatness, thickness uniformity and matched thermal expansion. The substrate specification should therefore be written from the downstream process backward.
Single-side polished substrates provide one functional surface and an economical rear surface. Double-side polishing is selected where both sides are optical, where parallelism matters or where the part will be bonded into a transparent stack. Holes, slots and alignment features should be completed before final cleaning and surface protection.
- Identify the functional side and allowed contact zones.
- State coating, bonding or deposition temperature.
- Define flatness and parallelism over the actual functional area.
- Specify surface finish before and after downstream processing.
- Choose trays, separators and bags that fit the next production step.
Round semiconductor-format parts should be specified as glass wafers, while temporary process supports belong under glass carrier wafers.
Frequently Asked Questions
What is a glass substrate?
A glass substrate is a flat, stable base used for coatings, thin films, sensors, electronics, bonding, microfluidics or optical assemblies. Its material, surface, geometry and cleanliness are selected for the downstream process.
Which materials does ANTGLASS use for glass substrates?
ANTGLASS manufactures substrates from borosilicate glass, fused silica, quartz glass, N-BK7, EAGLE XG, alkali-free glass, aluminosilicate glass, B 270 and other optical or technical glass grades.
Can substrates be double-side polished?
Yes. ANTGLASS supplies ground, lapped, single-side polished and double-side polished glass substrates according to the optical, coating, bonding and geometry requirements.
Can a glass substrate include holes and alignment features?
Yes. Substrates can include through holes, blind features where applicable, slots, notches, flats, alignment holes, chamfers and custom outlines.
How should glass substrates be packed for coating or bonding?
ANTGLASS uses cleaned, separated and protected packaging with functional-side identification, low-contact handling and trays, separators or bags selected for the substrate size and downstream process.