ANTGLASS manufactures TGV glass substrates and glass interposer blanks for advanced packaging, RF devices, MEMS, sensors and microelectronic integration.
ANTGLASS produces glass substrates with drawing-defined via diameter, pitch, taper, position, wafer thickness, TTV, bow, warp, surface condition and clean packaging.
Product Types and Selection
| Configuration | Typical use | Key specification |
|---|---|---|
| TGV wafer | Wafer-level packaging | Via map, diameter, pitch, TTV, bow and warp |
| Glass interposer | RF and microelectronic integration | Via geometry, dielectric behavior and metallization |
| MEMS substrate | Sensor and device integration | Alignment, bonding surfaces and cleanliness |
| Prototype via array | Process development | Test matrix, edge exclusion and inspection method |
Material and Substrate Options
ANTGLASS matches the substrate or optical material to the electrical, spectral, thermal, chemical and manufacturing requirements. Relevant material pages include Corning EAGLE XG Glass, Fused Silica Glass, SCHOTT BOROFLOAT 33 Glass.
Specifications to Put on the Drawing
- Substrate geometry: Format, thickness, TTV, bow, warp and edge profile
- Via geometry: Diameter, pitch, taper, position and via-map datum
- Integration stage: Bare via, metallization preparation or downstream process
- Material and substrate format
- Thickness, TTV, bow and warp
- Via diameter, pitch and map
- Taper and position tolerance
- Metallization stage and cleanliness
- Quantity and packaging
ANTGLASS Manufacturing Capabilities
ANTGLASS provides precision cutting, CNC contour machining, drilling, slotting, notching, chamfering, grinding, lapping, polishing, coating-compatible handling, ultrasonic cleaning and protected packaging. The manufacturing sequence is selected around the coated, optical, via, chamber or angular features that control the finished component.
- Review material, via map and downstream packaging process
- Prepare the substrate geometry, thickness and surface condition
- Create and finish through-glass via features
- Clean via bores and protect the substrate surfaces
- Inspect via geometry, position and wafer-level shape
Inspection, Cleaning and Packaging
Inspection is tied to the drawing and functional zones rather than a generic cosmetic check. Mechanical, optical, electrical or fluidic requirements are separated so the correct method and datum are used. Finished parts are cleaned and separated to protect critical faces, bores, coatings and edges.
- Via diameter, pitch, taper and true position
- Substrate thickness, TTV, bow and warp
- Edge exclusion, chips and crack screening
- Via cleanliness and surface condition before metallization
Typical Applications
- Glass interposers and RF packaging
- MEMS and sensor integration
- Wafer-level packaging and redistribution structures
- Microelectronic, photonic and research substrates
TGV Glass Substrates Design and Ordering Guide
Start the RFQ with the functional requirement and the measurement condition. A sheet-resistance value without a test position, a spectral value without wavelength and angle, or a geometric tolerance without a datum can produce conflicting interpretations. Mark all active, optical, conductive, sealing and contact zones directly on the drawing.
Separate critical requirements from general dimensions. ANTGLASS can then choose a stable process sequence, protect finished surfaces and use inspection methods that match the component function. For prototype work, identify which values are development targets and which are release criteria for repeat production.
- Identify the functional face and orientation datum.
- Define the clear, active or conductive area separately from the mechanical outline.
- State the inspection method or reference condition for critical values.
- Show protected edge zones, contacts, ports, coating masks or via exclusions.
- Include operating temperature, chemicals, optical band and assembly conditions.
Related Products, Materials and Solutions
Related products: Glass Wafers, Glass Carrier Wafers, Glass Substrates, ITO Glass. Related materials: Corning EAGLE XG Glass, Fused Silica Glass, SCHOTT BOROFLOAT 33 Glass. Related engineering solutions: Semiconductor, MEMS & Advanced Packaging Glass, Thin, Small & Complex Glass Parts, Cleaned Glass Components for Sensitive Assemblies.
Frequently Asked Questions
What is a TGV glass substrate?
A TGV substrate is a glass wafer or interposer containing through-glass vias that provide vertical electrical or fluidic paths for advanced packaging, RF, MEMS, sensors and microelectronic integration.
Which dimensions are critical for through-glass vias?
Define via diameter at the relevant surfaces, pitch, taper, true position, via depth, edge exclusion and datum structure. Substrate thickness, TTV, bow and warp must be specified with the via map.
Which glass materials can be used for TGV substrates?
Common candidates include alkali-free display glass, borosilicate glass and fused silica. Selection depends on thermal expansion, dielectric behavior, process temperature, optical needs, via process and downstream bonding.
Can ANTGLASS supply custom via arrays and interposer outlines?
Yes. ANTGLASS produces drawing-defined substrate formats, via patterns, edge profiles, flats, notches and alignment features for prototype and repeat packaging programs.
What should be stated about metallization in the RFQ?
State whether the requirement is a bare glass via substrate, a metallization-ready surface or a completed metallized interposer, together with adhesion, seed-layer, fill, planarity, cleaning and inspection expectations.